Annealing Twinning in Boron-Doped Ni<SUB>3</SUB>Al
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چکیده
منابع مشابه
Millisecond Microwave Annealing of Ultra-shallow Boron Doped Silicon
Next generation Si IC transistors, i.e. the 65 nm node, will require ultra-shallow doped regions with depths less than 17 nm and concentrations high enough to get a sheet resistance, Rs, lower than 760 ohms/square [1]. The current state of implant technology, taking into account reasonable throughput and cost considerations, results in as-implanted junction profiles that are slightly shallower ...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2002
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.43.1283